HardTech Pitch Competition

By mmuise

The HardTech Pitch Competition, held in partnership by ventureLAB and the Regional Municipality of York, is open to small and medium enterprises incorporated in Canada developing hardware innovations. Finalists will have the opportunity to pitch for their chance to take home a collective $50,000 in cash and showcase their breakthrough products and innovations in hardware technology to a broad audience including industry, investors, government, media, and more!

Comments on Funding:

Cmpanies pitch for their chance to take home a collective $50,000 in cash.

Deadline: Applications are closed. Stay tuned for future intake announcements.

‍Applicants must:

  • be small and medium-size enterprises that have developed or be developing a novel semiconductor, sensor, silicon-based IP or embedded system hardware product;
  • be incorporated in Canada;
  • have a business number (CRA);
  • have 99 or fewer employees, and earned less than $5M in revenue in the last 12 months;
  • be located in York Region or be committed to co-locate to York Region or at ventureLAB’s innovation hub for at least six months upon winning the prize (dependent on public health regulations). Note that this can be fulfilled through a ventureLAB membership, which will be provided free of charge to the winners.
  • Not be a winner of a previous ventureLAB pitch competition (Made in York Region 2019 or 2020; HardTech 2021);
  • Be available to participate on the orientation, pitch coaching, mock pitch day and pitch day events.
    Company innovations can impact, but are not limited to, the following industries:
  • CleanTech;
  • Electric Vehicles, Smart Vehicles, and Mobility (inclusive design);
  • MedTech and Wearables (Smart Glasses, etc.);
  • Smart Agriculture and Industrial Solutions;
  • Drones;
  • Smart Retail and Fintech hardware;
  • 5G and Next Gen Communications;
  • Smart City and Smart Factory applications deploying sensor systems, IOT and IIOT, and accelerated AI hardware.
Application Steps:

Applicants must complete and submit the online application form.

Documentation Needed:

No specific documentation has been identified.

Other Things to Note:

Applications for 2023 are NOW CLOSED.

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